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Location:
Cedar Rapids, IA
PRIMARY RESPONSIBILITY:
• Support the design, prototype assembly, documentation
and release to production of new RFIC and multi-chip
module (MCM) packages using appropriate technology.
• Acts as a liaison with internal Advanced Packaging
Group, Suppliers, and Internal and External Manufacturing.
• Direct and potentially manage Packaging resources
used in build, design, development and documentation
of industry leading wireless semiconductor products.
• Using appropriate tools, perform product cost
trade-offs, package integrity analysis (thermal,
mechanical, cross-sectioning, assembly process,
etc.) for customer and internal requirements.
• Define package requirements for product groups
assuring compliance with customer and internal Quality
and Reliability requirements.
• Support the
design and development of test fixture assemblies
for product development and production test.
This individual must work well in a team on
problems of a diverse scope where analysis of situations
or data requires a review of identifiable factors.
Must exercise judgment within defined procedures
and practices to determine appropriate solutions.
This position requires a BS degree and 2 years minimum
of experience with knowledge of state-of-the-art
materials and packaging related to semiconductor
technology. Experience with Thermal and Mechanical
Analysis, Auto-CAD and Cadence APD or similar CAD
tools is a preference. A basic understanding of
Micro-Electronic Packaging and Manufacturing is
also highly preferred
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