General question on Packaging and circuit Board - RF Cafe Forums

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JM
Post subject: General question on Packaging and circuit Board Posted: Fri Oct 06, 2006 4:46 pm

Lieutenant

Joined: Fri Jun 30, 2006 9:56 am
Posts: 1
Location: Blacksburg Virginia
Hello everybody,

I have an open and general question regarding material such as Roger3000, LTCC or Ceramic..
I have heard people complaning about those material at frequency above 30GHz, either for the loss, for the unstable lateral dimensions or price.
Does anyone has experience with those type of material for either packaging or circuit and could give me more details.. What problems do people usually face with those type of materials?
Is there a frequency at which there is no solution for chip on package or it is to expensive(above $100/inch^2)?? or just to much twinking required???

I hope my question is not to vague... and there is some kind of response...

Thank you
JM

_________________
Jean-Marc ROLLIN
RF Engineer
Rohm and Haas



Posted  11/12/2012